Rob Horsley

Statistics

Publications

Citations

136

H-Index

Active since

2004

Affiliations

Agilent Technologies (United States)(Current)

Flex (United States)

Endicott College

IBM (United States)

Rob Horsley is an author at Agilent Technologies (United States) specializing in materials engineering, packaging engineering, and package reliability.

Publications per year

2004–2004

Publications

Design for lead‐free solder joint reliability of high‐density packages

John H. Lau, Walter Dauksher, Joe Smetana et al. · Soldering and Surface Mount Technology · 2004 · 58 citations

Natural Sciences, Materials Engineering, Materials Science +15

Reliability testing and data analysis of lead‐free solder joints for high‐density packages

John H. Lau, Nick Hoo, Rob Horsley et al. · Soldering and Surface Mount Technology · 2004 · 25 citations

Engineering, Materials Engineering, Metallurgy +10

Hybrid Technology for the Rail Industry

Frank Donnelly, Raymond L. Cousineau, Rob Horsley · 2004 · 23 citations

Engineering, Automotive Engineering, Electrical Engineering +17

Failure analysis of lead‐free solder joints for high‐density packages

John H. Lau, Dongkai Shangguan, Todd Castello et al. · Soldering and Surface Mount Technology · 2004 · 18 citations

Natural Sciences, Materials Engineering, Materials Science +16

Design, materials and process for lead‐free assembly of high‐density packages

Joe Smetana, Rob Horsley, John H. Lau et al. · Soldering and Surface Mount Technology · 2004 · 12 citations

Agriculture, Materials Engineering, Materials Science +14

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