Reliability testing and data analysis of lead‐free solder joints for high‐density packages

Abstract

Temperature cycling tests, and statistical analysis of the results, for various high‐density packages on printed‐circuit boards with Sn‐Cu hot‐air solder levelling, electroless nickel‐immersion gold, and organic solder preservative finishes are investigated in this study. Emphasis is placed on the determination of the life distribution and reliability of the lead‐free solder joints of these high‐density package assemblies while they are subjected to temperature cycling conditions. A data acquisition system, the relevant failure criterion, and the data extraction method will be presented and examined. The life test data are best fitted to the Weibull distribution. Also, the sample mean, population mean, sample characteristic life, true characteristic life, sample Weibull slope, and true Weibull slope for some of the high‐density packages are provided and discussed. Furthermore, the relationship between the reliability and the confidence limits for a life distribution is established. Finally, the confidence levels for comparing the quality (mean life) of lead‐free solder joints of high‐density packages are determined.