Bob Sullivan

Design for lead‐free solder joint reliability of high‐density packages

John H. Lau, Walter Dauksher, Joe Smetana et al. · Soldering and Surface Mount Technology · 2004 · 58 citations

Natural Sciences, Materials Engineering, Materials Science +15

Predictive reliability models through validated correlation between power cycling and thermal cycling accelerated life tests

P. Towashiraporn, Ganesh Subbarayan, B. McIlvanie et al. · Soldering and Surface Mount Technology · 2002 · 36 citations

Engineering, Materials Engineering, Materials Science +17

Reliability testing and data analysis of lead‐free solder joints for high‐density packages

John H. Lau, Nick Hoo, Rob Horsley et al. · Soldering and Surface Mount Technology · 2004 · 25 citations

Engineering, Materials Engineering, Metallurgy +10

The effect of model building on the accuracy of fatigue life predictions in electronic packages

P. Towashiraporn, Ganesh Subbarayan, B. McIlvanie et al. · Microelectronics Reliability · 2003 · 18 citations

Engineering, Materials Engineering, Packaging Design +13

Failure analysis of lead‐free solder joints for high‐density packages

John H. Lau, Dongkai Shangguan, Todd Castello et al. · Soldering and Surface Mount Technology · 2004 · 18 citations

Natural Sciences, Materials Engineering, Materials Science +16