Srinivas Chada

Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure

Srinivas Chada, R.A. Fournelle, W. Laub et al. · Journal of Electronic Materials · 2000 · 108 citations

Materials Science, Materials Engineering, Engineering +9

An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates

Srinivas Chada, W. Laub, R.A. Fournelle et al. · Journal of Electronic Materials · 1999 · 56 citations

Materials Science, Engineering, Interconnect (Integrated Circuits) +11

The qualitative effects of various types of hygiene instrumentation on commercially pure titanium and titanium alloy implant abutments: an in vitro and scanning electron microscope study

Frieda Von Giese Brookshire, William W. Nagy, Virendra Dhuru et al. · Journal of Prosthetic Dentistry · 1997 · 41 citations

Intraoral Scanner, Hygiene Instrumentation, Various Types +3

Microstructural Investigation of Sn‐Ag and Sn‐Ag Solder Joints*

Srinivas Chada, A. Herrmann, W. Laub et al. · Soldering and Surface Mount Technology · 1997 · 20 citations

Materials Science, Microhardness Measurements, High Temperature Materials +12

Morphology of Surfaces Generated by Circular Wire Brushes

Robert J. Stango, R.A. Fournelle, Srinivas Chada · Journal of Engineering for Industry · 1995 · 17 citations

Materials Science, Characteristic Surface, Orthogonal Wire Brushing +13