W. Laub

Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure

Srinivas Chada, R.A. Fournelle, W. Laub et al. · Journal of Electronic Materials · 2000 · 108 citations

Materials Science, Materials Engineering, Engineering +9

A numerical method for predicting intermetallic layer thickness developed during the formation of solder joints

M. Schaefer, W. Laub, Janet M. Sabee et al. · Journal of Electronic Materials · 1996 · 56 citations

Materials Science, Friction Welding, Engineering +9

An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates

Srinivas Chada, W. Laub, R.A. Fournelle et al. · Journal of Electronic Materials · 1999 · 56 citations

Materials Science, Engineering, Interconnect (Integrated Circuits) +11

Energetic and kinetic aspects of the faceting transformation of a Σ3 grain boundary in Cu

T. Muschik, W. Laub, U. Wolf et al. · Acta Metallurgica et Materialia · 1993 · 36 citations

Materials Engineering, Materials Science, Engineering +8

Microstructural Investigation of Sn‐Ag and Sn‐Ag Solder Joints*

Srinivas Chada, A. Herrmann, W. Laub et al. · Soldering and Surface Mount Technology · 1997 · 20 citations

Materials Science, Microhardness Measurements, High Temperature Materials +12