Concepedia

Dongji Xie

DX

10

Publications

247

Citations

10

H-Index

2003

Active since

Affiliations

Flex (United States)(Current)

Dongji Xie is an author at Flex (United States) specializing in engineering, mechanical engineering, and materials science.

Top concepts

EngineeringMaterial ScienceMechanical EngineeringElectronic PackagingMechanics Of MaterialsMicrostructureSolid MechanicsCorrosionMaterials EngineeringSurface Science

Publications per year

2003–2010

10

Publications

10

Solder joint behavior of area array packages in board level drop for handheld devices

Dongji Xie, Minna Arra, Sanuny Yi et al. · 2004 · 61 citations

Advanced Packaging, Pcb Board, Chip-scale Package +15

Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications

Minna Arra, Dongkai Shangguan, Dongji Xie et al. · Journal of Electronic Materials · 2004 · 48 citations

Materials Engineering, Materials Science, Electrical Engineering +12

Materials characterization of the effect of mechanical bending on area array package interconnects

Daniel T. Rooney, N. Todd Castello, Mike Cibulsky et al. · Microelectronics Reliability · 2003 · 30 citations

Materials Science, Chip-scale Package, Engineering +10

Performance of lead-free solder joints under dynamic mechanical loading

Minna Arra, Dongji Xie, Dongkai Shangguan · 2003 · 26 citations

Friction Welding, Engineering, Mechanical Engineering +17

Head in pillow (HIP) and yield study on SIP and PoP assembly

Dongji Xie, Dongkai Shangguan, David Geiger et al. · 2009 · 16 citations

Materials Science, Engineering, Mechanical Engineering +9

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