David Geiger - Concepedia

Author

David Geiger

Flex (United States)

Also Known As

D. Geiger, D.A. Geiger, David A. Geiger, David Geiger

Publications

446

Citations

H-Index

Concepts

All Affiliations

Flex (United States)Henkel (Germany)California Polytechnic State University

About

David Geiger is an author at Flex (United States) specializing in engineering, mechanical engineering, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	8	8	151
2	Computer Engineering	3	3	45
3	Electrical Engineering	2	2	62
4	Medicine	1	1	130
5	Social Sciences	1	1	11

David Geiger

Publications

357

Citations

H-Index

Page 1

	Year	Citations
Melatonin promotes sleep in three species of diurnal nonhuman primates Irina V. Zhdanova, David Geiger, Anthony L. Schwagerl, Physiology & Behavior Sleep DisordersSleepDiurnal Nonhuman PrimatesAlertnessSleep Disorder	2002	130
Diffuse osteopenia and myelopathy in a puppy fed a diet composed of an organic premix and raw ground beef Mark B Taylor, David Geiger, Korinn E. Saker, Journal of the American Veterinary Medical Association	2009	66
Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds Daniel T. Rooney, DeePak Nager, David Geiger, Microelectronics Reliability Materials ScienceElectrical EngineeringChip-scale PackageEngineeringMetallurgical Integrity	2005	34
Drop test reliability of lead-free chip scale packages Andrew Farris, Jianbiao Pan, Albert A. Liddicoat, EngineeringMechanical EngineeringReliability EngineeringAdvanced Packaging (Semiconductors)Pulse Duration	2008	28
Package stacking in SMT for 3D PCB assembly David Geiger, Dongkai Shangguan, Siu-Chung Tam, EngineeringPackage StackingMechanical EngineeringComputer-aided DesignAdvanced Packaging (Semiconductors)	2004	18
A study of SMT assembly processes for fine pitch CSP packages Minna Arra, David Geiger, Dongkai Shangguan, Soldering and Surface Mount Technology EngineeringIndustrial EngineeringChip Scale PackageMechanical EngineeringSmt Assembly	2004	16
Head in pillow (HIP) and yield study on SIP and PoP assembly Dongji Xie, Dongkai Shangguan, David Geiger, Materials ScienceEngineeringMechanical EngineeringDesignSolder Alloy	2009	16
Failure mechanism and mitigation of PCB pad cratering Dongji Xie, David Geiger, Dongkai Shangguan, Materials SciencePcb MaterialsStructural IntegrityEngineeringPad Cratering	2010	15
Drop impact reliability of edge-bonded lead-free chip scale packages Andrew Farris, Jianbiao Pan, Albert A. Liddicoat, Microelectronics Reliability ReliabilityReliability EngineeringEngineeringAdvanced Packaging (Semiconductors)Chip-scale Package	2009	13
Process development and reliability evaluation for inline Package-on-Package (pop) assembly Jonas Sjöberg, David Geiger, Dongkai Shangguan Software MaintenanceEngineeringPackage StackingMechanical EngineeringProcess Development	2008	11

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