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Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds

Materials ScienceElectrical EngineeringChip-scale PackageEngineeringMetallurgical IntegrityAdvanced Packaging (Semiconductors)CorrosionChip On BoardMechanical EngineeringBoard Wire BondsChip AttachmentElectronic PackagingMicroelectronicsWire Bonding Performance