Concepedia

Daniel T. Rooney

DT

Statistics

Publications

4

Citations

144

H-Index

4

Active since

2003

Affiliations

Flex (United States)(Current)

Daniel T. Rooney is an author at Flex (United States) specializing in materials engineering, chip packaging, and mechanical behavior of materials.

Publications per year

2003–2005

4

Publications

4

Solder joint behavior of area array packages in board level drop for handheld devices

Dongji Xie, Minna Arra, Sanuny Yi et al. · 2004 · 61 citations

Natural Sciences, Materials Engineering, Materials Science +14

Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds

Daniel T. Rooney, DeePak Nager, David Geiger et al. · Microelectronics Reliability · 2005 · 34 citations

Engineering, Materials Engineering, Materials Science +17

Materials characterization of the effect of mechanical bending on area array package interconnects

Daniel T. Rooney, N. Todd Castello, Mike Cibulsky et al. · Microelectronics Reliability · 2003 · 31 citations

Engineering, Materials Engineering, Materials Science +16

Package stacking in SMT for 3D PCB assembly

David Geiger, Dongkai Shangguan, Siu-Chung Tam et al. · 2004 · 18 citations

Engineering, Materials Engineering, Manufacturing Processes +13

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