Materials characterization of the effect of mechanical bending on area array package interconnects

Are we over designing for solder joint reliability? Field vs. accelerated conditions, realistic vs. specified requirements

A. Syed, M. Doty · 2003 · 33 citations

Engineering, Industrial Engineering, Mechanical Engineering +21

Reliability performance and failure mode of high I/O thermally enhanced ball grid array packages

Richard Coyle, T.I. Ejim, A. Holliday et al. · 2002 · 15 citations

Engineering, Mechanical Engineering, High I/o +24

Reliability characterization of the SLICC package

Pradeep Lall, Gerald Gold, Benjamin N. Miles et al. · 2002 · 12 citations

Solder-bumped Integrated Circuit, Engineering, Verification +20

The Effect of Ball Pad Metallurgy and Ball Composition on Solder Ball Integrity of Plastic Ball Grid Array Packages

Chong Zhong, Sung Yi · Proceedings - International Symposium for Testing and Failure Analysis · 1998 · 10 citations

Materials Science, Ball Pad Metallurgy, Engineering +15