T.I. Ejim

Assembly and reliability of thermally enhanced high I/O BGA packages

T.I. Ejim, D.B. Hollesen, A. Holliday et al. · 2002 · 18 citations

Materials Engineering, Materials Science, Electrical Engineering +14

Bulk III-V Compound Semi-Conductor Crystal Growth

J. E. Clemans, T.I. Ejim, William A. Gault et al. · AT&T Technical Journal · 1989 · 16 citations

Materials Science, Materials Engineering, Electrical Engineering +13

Reliability performance and failure mode of high I/O thermally enhanced ball grid array packages

Richard Coyle, T.I. Ejim, A. Holliday et al. · 2002 · 15 citations

Engineering, Mechanical Engineering, High I/o +24

The influence of nickel/gold surface finish on the assembly quality and long term reliability of thermally enhanced BGA packages

Richard Coyle, A. Holliday, Paul Mescher et al. · 2003 · 14 citations

Brittle Fractures, Engineering, Mechanical Engineering +18

Solidification behavior of low and high thermal conductivity materials in a Bridgman-Stockbarger furnace

T.I. Ejim, W. A. Jesser, A. L. Fripp · Journal of Crystal Growth · 1984 · 13 citations

Materials Science, Materials Engineering, Engineering +13