Concepedia

Richard Coyle

RC

30

Publications

917

Citations

18

H-Index

1980

Active since

Affiliations

Nokia (United States)(Current)

Binghamton University

Universal Instruments (United States)

University of Limerick

Imperial College London

Richard Coyle is an author at Nokia (United States) specializing in materials science, engineering, and electronic packaging.

Top concepts

EngineeringMaterial ScienceMicrostructureElectronic PackagingMechanical EngineeringMechanics Of MaterialsThermal EngineeringSolid MechanicsMaterials EngineeringCorrosion

Publications per year

1980–2024

30

Publications

30

Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

Richard Coyle, Keith Sweatman, Babak Arfaei · JOM · 2015 · 93 citations · Full text

Materials Science, Engineering, Thermal Fatigue Evaluation +11

The influence of room temperature aging on ball shear strength and microstructure of area array solder balls

Richard Coyle, P.P. Solan, A.J. Serafino et al. · 2002 · 68 citations

Engineering, Mechanical Engineering, Mechanics Of Materials +16

Solder metallization interdiffusion in microelectronic interconnects

A. Zribi, Richard R. Chromik, R. Presthus et al. · IEEE Transactions on Components and Packaging Technologies · 2000 · 60 citations

Engineering, Mechanical Engineering, Solder Metallization Interdiffusion +17

A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

Yilun Xu, Jingwei Xian, Stoyan Stoyanov et al. · International Journal of Plasticity · 2022 · 60 citations · Full text

Friction Welding, Engineering, Mechanical Engineering +17

Shear testing and failure mode analysis for evaluation of BGA ball attachment

Robert Erich, Richard Coyle, G.M. Wenger et al. · 2003 · 56 citations

Engineering, Shear Testing, Mechanical Engineering +22

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