Concepedia

A.J. Serafino

AS

2

Publications

82

Citations

2

H-Index

2002

Active since

Affiliations

Nokia (United States)(Current)

A.J. Serafino is an author at Nokia (United States) specializing in mechanics of materials, mechanical engineering, and materials science.

Top concepts

EngineeringMicrostructureSolid MechanicsMaterial ScienceElectronic PackagingMechanical EngineeringMechanics Of MaterialsMechanicsFailure AnalysisMicrofabrication

Publications per year

2002–2003

2

Publications

2

The influence of room temperature aging on ball shear strength and microstructure of area array solder balls

Richard Coyle, P.P. Solan, A.J. Serafino et al. · 2002 · 68 citations

Engineering, Mechanical Engineering, Mechanics Of Materials +16

Ball shear versus ball pull test methods for evaluating interfacial failures in area array packages

Richard Coyle, A.J. Serafino, P.P. Solan · 2003 · 14 citations

Engineering, Mechanical Engineering, Ball Shear Test +19

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