Concepedia

Mechanical Bending Reliability

Mechanical Bending Reliability is a performance metric that quantifies the ability of a thin-film transistor to maintain its electrical functionality under repeated or sustained mechanical bending stress, distinguishing it from other reliability metrics by specifically addressing deformation-induced degradation in flexible electronics.

21

Publications

642

Citations

129

Authors

39

Institutions

Publications per year

2017–2026

8

Parents

Publications

21

A Highly Reliable Copper Nanowire/Nanoparticle Ink Pattern with High Conductivity on Flexible Substrate Prepared via a Flash Light-Sintering Technique

Sung-Jun Joo, Sung-Hyeon Park, Chang-Jin Moon et al. · ACS Applied Materials & Interfaces · 2015 · 142 citations

, , +17

Electrical Characterization of Flexible InGaZnO Transistors and 8-b Transponder Chip Down to a Bending Radius of 2 mm

Ashutosh Tripathi, Kris Myny, Bo Hou et al. · IEEE Transactions on Electron Devices · 2015 · 68 citations

, , +17

Durability under mechanical bending of the indium tin oxide films deposited on polymer substrate by thermionically enhanced sputtering

Y.F. Lan, Wu Peng, Y.H. Lo et al. · Organic Electronics · 2010 · 54 citations

, , +16

High flex cycle testing of CVD monolayer WS <sub>2</sub> TFTs on thin flexible polyimide

Yiyang Gong, Victor Carôzo, Haoyu Li et al. · 2D Materials · 2016 · 36 citations

, , +16

Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests

Jens Heilmann, Ivan Nikitin, Uwe Zschenderlein et al. · Microelectronics Reliability · 2017 · 35 citations

, , +14

1–5 of 21

Authors

129

  1. TL
    Takhee Lee

    Gwangju Institute of Science and Technology, South Korea

    1 publications · 14 citations

    1

    h-index

  2. SL
    Seung-Jong Lee

    Auburn University, United States

    1 publications · 21 citations

    1

    h-index

  3. TN
    Thomas N. Jackson

    Pennsylvania State University, United States

    1 publications · 36 citations

    1

    h-index

  4. BJ
    Bernt J. Leira

    Norwegian University of Science and Technology, Norway

    1 publications · 31 citations

    1

    h-index

  5. KT
    Kyong Taek Lee

    Samsung (South Korea), South Korea

    1 publications · 16 citations

    1

    h-index

1–5 of 129

Institutions

39

  1. Hanyang University

    Seoul, South Korea

    2 h-index

    6 publications

    596 citations

  2. Auburn University

    Auburn, United States

    2 h-index

    8 publications

    141 citations

  3. Motorola (United States)

    Schaumburg, United States

    2 h-index

    3 publications

    59 citations

  4. Feng Chia University

    Taichung, Taiwan

    1 h-index

    3 publications

    162 citations

  5. NextFlex

    San Jose, United States

    1 h-index

    1 publications

    12 citations

  6. Peking University

    Beijing, China

    1 h-index

    1 publications

    16 citations

  7. Norsk Hydro (Norway)

    Oslo, Norway

    1 h-index

    1 publications

    31 citations

  8. Fraunhofer Center for Silicon Photovoltaics

    Halle, Germany

    1 h-index

    5 publications

    100 citations

1–8 of 39

Venues

  1. Microelectronics Reliability

    3 publications · 78 citations

    3

    h-index

  2. IEEE Electron Device Letters

    2 publications · 32 citations

    2

    h-index

  3. Nanotechnology

    1 publications · 14 citations

    1

    h-index

  4. IEEE Transactions on Electron Devices

    1 publications · 68 citations

    1

    h-index

  5. Science China Technological Sciences

    1 publications · 19 citations

    1

    h-index

1–5