Reliability characterization of the SLICC package

Abstract

SLICC (Slightly Larger than IC Carrier) is a chip-scale ball grid array (BGA) package currently under development at Motorola. The SLICC package consists of a solder-bumped integrated circuit (IC) which is flip-chip bonded to an interposer substrate-approximately 8 mils thick-and then underfilled with an encapsulant. Chip I/Os are routed to package I/Os through plated through holes (PTHs) in the interposer substrate. Package I/Os are composed of solder bumps (approx. 22.2 mils in diameter on a 32-mil pitch) attached to the bottom side of the interposer substrate. The most apparent benefit of the SLICC package is its utilization of the area efficiency associated with direct chip attach (DCA) technology, coupled with the assembly, test, and repair simplicity afforded by BGA-type packaging.