Concepedia

Package Interconnects

Package Interconnects is a type of interconnect technology that comprises the physical and electrical connections linking integrated circuits to the external environment through a semiconductor package, distinguished by its role in enabling signal, power, and thermal transmission between the chip and the printed circuit board.

123

Publications

4.7K

Citations

486

Authors

105

Institutions

Publications per year

2017–2026

17

Parents

Publications

123

Electronics Without Lead

Yi Li, Kyoung‐sik Moon, C.P. Wong · Science · 2005 · 496 citations

, , +14

Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

Ravi Mahajan, Robert Sankman, Neha Patel et al. · 2016 · 357 citations

, , +17

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Kim S. Siow · Journal of Electronic Materials · 2014 · 312 citations · Full text

, , +16

Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level

Debendra Das Sharma, Gerald Pasdast, Zhiguo Qian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 177 citations

, , +17

Electronic packaging materials science III

R. J. Jaccodine, Kelly A. Jackson, E.D. Lillie et al. · OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 1985 · 147 citations

, , +17

1–5 of 123

Authors

486

  1. KA
    Kemal Aygün

    Intel (United States), United States

    5 publications · 721 citations

    5

    h-index

  2. RT
    Rao Tummala

    Georgia Institute of Technology, United States

    5 publications · 124 citations

    5

    h-index

  3. DP
    D. P. Seraphim

    IBM (United States), United States

    4 publications · 133 citations

    4

    h-index

  4. CR
    Christian Rusch

    Karlsruhe Institute of Technology, Germany

    4 publications · 160 citations

    4

    h-index

  5. TZ
    Thomas Zwick

    Karlsruhe Institute of Technology, Germany

    4 publications · 160 citations

    4

    h-index

1–5 of 486

Institutions

105

  1. Georgia Institute of Technology

    Atlanta, United States

    11 h-index

    47 publications

    2.5K citations

  2. Intel (United States)

    Santa Clara, United States

    10 h-index

    46 publications

    6K citations

  3. IBM (United States)

    Armonk, United States

    8 h-index

    48 publications

    1.1K citations

  4. IMEC

    Leuven, Belgium

    4 h-index

    22 publications

    324 citations

  5. NEC (Japan)

    Tokyo, Japan

    4 h-index

    37 publications

    953 citations

  6. Karlsruhe Institute of Technology

    Karlsruhe, Germany

    4 h-index

    23 publications

    920 citations

  7. Hitachi (Japan)

    Tokyo, Japan

    3 h-index

    10 publications

    204 citations

  8. Siemens (Germany)

    Munich, Germany

    2 h-index

    8 publications

    318 citations

1–8 of 105

Venues

  1. Microelectronics Reliability

    8 publications · 272 citations

    8

    h-index

  2. 5

    h-index

  3. Journal of Electronic Materials

    JEM · 4 publications · 491 citations

    4

    h-index

  4. IEEE Transactions on Advanced Packaging

    3 publications · 32 citations

    3

    h-index

  5. 3

    h-index

1–5