Gerald Pasdast

Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level

Debendra Das Sharma, Gerald Pasdast, Zhiguo Qian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 177 citations

Engineering, Computer Engineering, Electrical Engineering +17

Sapphire Rapids: The Next-Generation Intel Xeon Scalable Processor

Nevine Nassif, Ashley O. Munch, Carleton L. Molnar et al. · 2022 IEEE International Solid- State Circuits Conference (ISSCC) · 2022 · 102 citations

Engineering, Computer Engineering, Computer Science +17

High-performance, power-efficient three-dimensional system-in-package designs with universal chiplet interconnect express

Debendra Das Sharma, Gerald Pasdast, Sathya Tiagaraj et al. · Nature Electronics · 2024 · 73 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

Hybrid Bonding Interconnect for Advanced Heterogeneously Integrated Processors

Adel Elsherbini, Shawna M. Liff, Johanna Swan et al. · 2021 · 69 citations

Engineering, Computer Engineering, Electrical Engineering +17

Enabling Next Generation 3D Heterogeneous Integration Architectures on Intel Process

Adel Elsherbini, K. Jun, Shawna M. Liff et al. · 2022 International Electron Devices Meeting (IEDM) · 2022 · 65 citations

Engineering, Computer Engineering, Electrical Engineering +17