K. Jun

3D heterogeneous integration of high performance high-K metal gate GaN NMOS and Si PMOS transistors on 300mm high-resistivity Si substrate for energy-efficient and compact power delivery, RF (5G and beyond) and SoC applications

Han Wui Then, Changyang Huang, B. Krist et al. · 2019 · 103 citations

Engineering, Electrical Engineering, Materials Science +17

300mm Heterogeneous 3D Integration of Record Performance Layer Transfer Germanium PMOS with Silicon NMOS for Low Power High Performance Logic Applications

W. Rachmady, Ankur Agrawal, Seung-Hun Sung et al. · 2019 · 79 citations

Engineering, Computer Engineering, Electrical Engineering +11

Enabling Next Generation 3D Heterogeneous Integration Architectures on Intel Process

Adel Elsherbini, K. Jun, Shawna M. Liff et al. · 2022 International Electron Devices Meeting (IEDM) · 2022 · 65 citations

Engineering, Computer Engineering, Electrical Engineering +17

GaN and Si Transistors on 300mm Si(111) Enabled by 3D Monolithic Heterogeneous Integration

Han Wui Then, M. Radosavljević, P. Agababov et al. · 2020 · 25 citations

Engineering, Electrical Engineering, Materials Science +17

Opportunities in 3-D stacked CMOS transistors

M. Radosavljević, C.-Y. Huang, W. Rachmady et al. · 2021 IEEE International Electron Devices Meeting (IEDM) · 2021 · 24 citations

Engineering, Computer Engineering, Electrical Engineering +17