Debendra Das Sharma

Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level

Debendra Das Sharma, Gerald Pasdast, Zhiguo Qian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 177 citations

Engineering, Computer Engineering, Electrical Engineering +17

A fast and efficient strategy for submesh allocation in mesh-connected parallel computers

Debendra Das Sharma, Dhiraj K. Pradhan · 2002 · 79 citations

Computing, Computer Engineering, Computer Science +16

High-performance, power-efficient three-dimensional system-in-package designs with universal chiplet interconnect express

Debendra Das Sharma, Gerald Pasdast, Sathya Tiagaraj et al. · Nature Electronics · 2024 · 73 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

Compute Express Link®: An open industry-standard interconnect enabling heterogeneous data-centric computing

Debendra Das Sharma · 2022 · 58 citations

Engineering, Computer Engineering, Computer Science +17

Compute Express Link (CXL): Enabling Heterogeneous Data-Centric Computing With Heterogeneous Memory Hierarchy

Debendra Das Sharma · IEEE Micro · 2022 · 45 citations

Engineering, Computer Engineering, Computer Science +17