Kemal Aygün

Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

Ravi Mahajan, Robert Sankman, Neha Patel et al. · 2016 · 357 citations

Engineering, Computer Engineering, Electrical Engineering +17

Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level

Debendra Das Sharma, Gerald Pasdast, Zhiguo Qian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 177 citations

Engineering, Computer Engineering, Electrical Engineering +17

Analysis of transient electromagnetic scattering from closed surfaces using a combined field integral equation

B. Shanker, A. Arif Ergin, Kemal Aygün et al. · IEEE Transactions on Antennas and Propagation · 2000 · 161 citations

Natural Sciences, Computational Engineering, Electrical Engineering +17

Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities

Ravi Mahajan, Xiaoqian Li, Joshua B. Fryman et al. · Journal of Lightwave Technology · 2021 · 152 citations

Engineering, Electrical Engineering, High-performance Computing +17

Analysis of transient electromagnetic scattering phenomena using a two-level plane wave time-domain algorithm

B. Shanker, A. Arif Ergin, Kemal Aygün et al. · IEEE Transactions on Antennas and Propagation · 2000 · 101 citations

Computing, Computational Engineering, Electrical Engineering +15