Electronic packaging materials science III

TLDR

The proceedings cover electronic packaging materials science, highlighting how increasing system density, speed, and thermal demands elevate the importance of packaging and interconnection technologies and the associated material challenges. The paper examines how these system trends drive material demands in electronic packaging. The authors describe new deposition, etching, and interfacial adhesion processes and address packaging challenges for GaAs and optoelectronic circuits.

Abstract

This volume is the proceedings of the symposia on electronic packaging materials science. The symposium included overviews as well as papers which addressed levels of packaging. The packaging and interconnection technologies for electronic systems are becoming an increasingly important part of these systems in terms of their cost, functionality, and complexity. This trend is being driven by system trends toward higher density, higher speed, and higher thermal dissipation. The nature of these trends, and their impact on the demands placed on the materials are covered. New processes for depositing, etching and promoting interfacial adhesion are described. Particular materials issues associated with interconnection on the IC, from the IC to its package and between ICs are covered. The authors have dealt with issues particular to the packaging of Ga As and optoelectronic circuits.