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Mike Cibulsky

MC

1

Publications

30

Citations

1

H-Index

2003

Active since

Affiliations

Flex (United States)(Current)

Mike Cibulsky is an author at Flex (United States) specializing in electronic packaging, mechanics of materials, and mechanical engineering.

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Publications per year

2003–2003

1

Publications

1

Materials characterization of the effect of mechanical bending on area array package interconnects

Daniel T. Rooney, N. Todd Castello, Mike Cibulsky et al. · Microelectronics Reliability · 2003 · 30 citations

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