Concepedia

Sanuny Yi

SY

2

Publications

100

Citations

2

H-Index

2002

Active since

Affiliations

Flex (United States)(Current)

Sanuny Yi is an author at Flex (United States) specializing in electronic packaging, mechanical engineering, and engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringCorrosion3D PrintingSolid MechanicsMaterial ScienceMicroelectronicsPowder MetallurgyAdvanced Packaging

Publications per year

2002–2004

2

Publications

2

Solder joint behavior of area array packages in board level drop for handheld devices

Dongji Xie, Minna Arra, Sanuny Yi et al. · 2004 · 61 citations

Advanced Packaging, Pcb Board, Chip-scale Package +15

Development of lead-free wave soldering process

Minna Arra, Dongkai Shangguan, Sanuny Yi et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 39 citations

Materials Science, Materials Engineering, Chemical Engineering +13

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