Sami T. Nurmi

Mechanical and microstructural properties of SnAgCu solder joints

Janne J. Sundelin, Sami T. Nurmi, T. Lepistö et al. · Materials Science and Engineering A · 2006 · 114 citations

Materials Science, Friction Welding, Engineering +8

Recrystallization behaviour of SnAgCu solder joints

Janne J. Sundelin, Sami T. Nurmi, T. Lepistö · Materials Science and Engineering A · 2007 · 96 citations

Materials Science, Materials Engineering, Engineering +7

The effect of solder paste composition on the reliability of SnAgCu joints

Sami T. Nurmi, Janne J. Sundelin, E. Ristolainen et al. · Microelectronics Reliability · 2003 · 49 citations

Snagcu Joints, Engineering, Mechanical Engineering +3

The influence of multiple reflow cycles on solder joint voids for lead‐free PBGAs

Sami T. Nurmi, Janne J. Sundelin, E. Ristolainen et al. · Soldering and Surface Mount Technology · 2003 · 19 citations

Materials Science, Materials Engineering, Electrical Engineering +9

The effect of PCB surface finish on lead‐free solder joints

Sami T. Nurmi, Janne J. Sundelin, E. Ristolainen et al. · Soldering and Surface Mount Technology · 2005 · 15 citations

Materials Science, Pbga Solder Joints, Engineering +11