Concepedia

Kuo‐Ning Chiang

KC

Statistics

Publications

112

Citations

2.8K

H-Index

30

Active since

1990

Affiliations

National Tsing Hua University(Current)

Industrial Technology Research Institute

Taiwan Semiconductor Manufacturing Company (Taiwan)

Georgia Institute of Technology

Feng Chia University

Kuo‐Ning Chiang is an author at National Tsing Hua University specializing in engineering, materials engineering, and materials science.

Publications per year

1990–2023

112

Publications

112

An overview of solder bump shape prediction algorithms with validations

Kuo‐Ning Chiang, Chang-An Yuan · IEEE Transactions on Advanced Packaging · 2001 · 118 citations

Engineering, Materials Engineering, Materials Science +17

Thermal Modeling of Temperature Distribution in Metal Additive Manufacturing Considering Effects of Build Layers, Latent Heat, and Temperature-Sensitivity of Material Properties

Elham Mirkoohi, Jinqiang Ning, Peter Bocchini et al. · Journal of Manufacturing and Materials Processing · 2018 · 92 citations · Full text

Engineering, Manufacturing Engineering, Materials Engineering +17

Sensitivity analysis of packaging effect of silicon-based piezoresistive pressure sensor

Tsung-Lin Chou, Chen-Hung Chu, Chun‐Te Lin et al. · Sensors and Actuators A Physical · 2009 · 81 citations

Engineering, Materials Engineering, Materials Science +14

Current crowding-induced electromigration in SnAg3.0Cu0.5 microbumps

Kuo‐Ning Chiang, Chien Chen Lee, Chang‐Chun Lee et al. · Applied Physics Letters · 2006 · 75 citations

Engineering, Electrical Engineering, Materials Science +17

Reliability Analysis and Design for the Fine-Pitch Flip Chip BGA Packaging

Cheng Peng, C.-M. Liu, Jujian Lin et al. · IEEE Transactions on Components and Packaging Technologies · 2004 · 73 citations

Engineering, Materials Engineering, Packaging Design +14

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