Jujian Lin

Reliability Analysis and Design for the Fine-Pitch Flip Chip BGA Packaging

Cheng Peng, C.-M. Liu, Jujian Lin et al. · IEEE Transactions on Components and Packaging Technologies · 2004 · 73 citations

Electrical Engineering, Chip-scale Package, Engineering +15

High responsivity of GaN p-i-n photodiode by using low-temperature interlayer

Jujian Lin, Yuezeng Su, S. J. Chang et al. · Applied Physics Letters · 2007 · 36 citations

Wide-bandgap Semiconductor, Electrical Engineering, Engineering +11

High coercivity of CoCrTa on a very thin Cr underlayer

Jujian Lin, Chun-Wei Wu, J.M. Sivertsen · IEEE Transactions on Magnetics · 1990 · 33 citations

Magnetic Properties, Engineering, Thin Film Process Technology +16

An Easy-to-Fabricate Circular TE₂₁/TE₀₁ Mode Generator

Junchen Ren, Guoxiang Shu, Jingcong He et al. · IEEE Transactions on Electron Devices · 2021 · 16 citations

Design and Measurement of a Terahertz Band Rectangular TE₂₀ Mode Power Coupling Structure for High-Order Overmoded Multiple Sheet Electron Beam Devices

Guoxiang Shu, Junzhe Deng, Zhijie Huang et al. · IEEE Electron Device Letters · 2020 · 15 citations

Thz Photonics, Terahertz Technology, Engineering +18