Chun‐Te Lin

Sensitivity analysis of packaging effect of silicon-based piezoresistive pressure sensor

Tsung-Lin Chou, Chen-Hung Chu, Chun‐Te Lin et al. · Sensors and Actuators A Physical · 2009 · 81 citations

Engineering, Materials Engineering, Materials Science +14

Performance and package effect of a novel piezoresistive pressure sensor fabricated by front-side etching technology

Chih‐Tang Peng, Ji‐Cheng Lin, Chun‐Te Lin et al. · Sensors and Actuators A Physical · 2004 · 59 citations

Engineering, Materials Engineering, Materials Science +12

Preparation and properties of bisphenol-F based boron-phenolic resin/modified silicon nitride composites and their usage as binders for grinding wheels

Chun‐Te Lin, Hsun-Tsing Lee, Jem-Kun Chen · Applied Surface Science · 2015 · 42 citations

Natural Sciences, Materials Engineering, Materials Science +10

Reliability tests for a three dimensional chip stacking structure with through silicon via connections and low cost

Tzu-Ying Kuo, Shu‐Ming Chang, Ying-Ching Shih et al. · 2008 · 36 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

Synthesis and characterization of molybdenum/phenolic resin composites binding with aluminum nitride particles for diamond cutters

Chun‐Te Lin, Hsun-Tsing Lee, Jem-Kun Chen · Applied Surface Science · 2013 · 28 citations

Natural Sciences, Materials Engineering, Materials Science +9