Publication | Closed Access
Performance and package effect of a novel piezoresistive pressure sensor fabricated by front-side etching technology
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Citations
7
References
2004
Year
EngineeringSensorsMicrofabricationMechanical EngineeringPackage EffectPiezoelectricitySensor DesignPiezoelectric MaterialInstrumentationSensor TechnologyMicromachined Ultrasonic Transducer
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