Concepedia

Author

Chih‐Tang Peng

National Tsing Hua University

Also Known As

Chih-Tang Peng, Chih-tang Peng, Chih‐Tang Peng

15

Publications

158

Citations

7

H-Index

19

Concepts

All Affiliations

National Tsing Hua UniversityIndustrial Technology Research Institute
CP

About

Chih‐Tang Peng is an author at National Tsing Hua University specializing in engineering, electronic packaging, and mechanical engineering.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

6

6

130

2

Materials Science

3

3

41

3

Computer Engineering

2

2

21

4

Electrical Engineering

2

2

30

5

Materials Engineering

1

1

20

Chih‐Tang Peng

×

6

Publications

130

Citations

6

H-Index

YearCitations

Performance and package effect of a novel piezoresistive pressure sensor fabricated by front-side etching technology

Chih‐Tang Peng, Ji‐Cheng Lin, Chun‐Te Lin,

Sensors and Actuators A Physical

2004

59

Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn–3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip

Chih‐Tang Peng, Chia‐Tai Kuo, Kuo‐Ning Chiang,

Microelectronics Reliability

2005

20

Packaging effect investigation of CMOS compatible pressure sensor using flip chip and flex circuit board technologies

Chang‐Chun Lee, Chih‐Tang Peng, Kuo‐Ning Chiang

Sensors and Actuators A Physical

2005

19

Design, fabrication and comparison of lead-free/eutectic solder joint reliability of flip chip package

Chih‐Tang Peng, Kuo‐Ning Chiang, T. Ku,

2004

11

Parametric reliability analysis of no-underfill flip chip package

Kuo‐Ning Chiang, Zheng-Nan Liu, Chih‐Tang Peng

IEEE Transactions on Components and Packaging Technologies

2001

11

Failure life prediction and factorial design of lead‐free flip chip package

Chien‐Chia Chiu, Chung‐Jung Wu, Chih‐Tang Peng,

Journal of the Chinese Institute of Engineers

2007

10

Page 1