Concepedia

Chih‐Tang Peng

CP

6

Publications

130

Citations

6

H-Index

2001

Active since

Affiliations

National Tsing Hua University(Current)

Industrial Technology Research Institute

Chih‐Tang Peng is an author at National Tsing Hua University specializing in engineering, electronic packaging, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingMicroelectronicsMechanical EngineeringMaterial ScienceReliabilitySensor DesignComputer EngineeringElectrical EngineeringReliability Engineering

Publications per year

2001–2007

6

Publications

6

Performance and package effect of a novel piezoresistive pressure sensor fabricated by front-side etching technology

Chih‐Tang Peng, Ji‐Cheng Lin, Chun‐Te Lin et al. · Sensors and Actuators A Physical · 2004 · 59 citations

Engineering, Sensors, Microfabrication +8

Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn–3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip

Chih‐Tang Peng, Chia‐Tai Kuo, Kuo‐Ning Chiang et al. · Microelectronics Reliability · 2005 · 20 citations

Materials Science, Materials Engineering, Intermetallic Compounds +8

Packaging effect investigation of CMOS compatible pressure sensor using flip chip and flex circuit board technologies

Chang‐Chun Lee, Chih‐Tang Peng, Kuo‐Ning Chiang · Sensors and Actuators A Physical · 2005 · 19 citations

Flip Chip, Electrical Engineering, Chip-scale Package +9

Design, fabrication and comparison of lead-free/eutectic solder joint reliability of flip chip package

Chih‐Tang Peng, Kuo‐Ning Chiang, T. Ku et al. · 2004 · 11 citations

Materials Science, Electrical Engineering, Chip-scale Package +11

Parametric reliability analysis of no-underfill flip chip package

Kuo‐Ning Chiang, Zheng-Nan Liu, Chih‐Tang Peng · IEEE Transactions on Components and Packaging Technologies · 2001 · 11 citations

Reliability, 3D Ic Architecture, Reliability Engineering +13

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