Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn–3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip - Concepedia

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Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn–3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip

20

Citations

11

References

2005

Year

Chih‐Tang Peng, Chia‐Tai Kuo, Kuo‐Ning Chiang, Terry Ku, Kenny Chang

Microelectronics Reliability

Materials ScienceMaterials EngineeringIntermetallic CompoundsEngineeringMechanical EngineeringCopper ChipMetallurgical ProcessElectronic PackagingMechanical Behavior AnalysisMicrostructureMetal Processing

References

	Year	Citations

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