Concepedia

Chia‐Tai Kuo

CK

4

Publications

93

Citations

4

H-Index

2003

Active since

Affiliations

National Tsing Hua University(Current)

Industrial Technology Research Institute

Chia‐Tai Kuo is an author at National Tsing Hua University specializing in engineering, mechanical engineering, and electronic packaging.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMechanical EngineeringMaterials EngineeringMechanics Of MaterialsMicrostructureApplied PhysicsOptoelectronicsPolymer Science

Publications per year

2003–2007

4

Publications

4

Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application

Chia‐Tai Kuo, Ming‐Chuen Yip, Kuo‐Ning Chiang · Microelectronics Reliability · 2003 · 33 citations

Materials Engineering, Materials Science, Engineering +13

Enhancement of Flip-Chip Light-Emitting Diodes With Omni-Directional Reflector and Textured Micropillar Arrays

Chia-En Lee, Yi-Jiun Lee, Hao‐Chung Kuo et al. · IEEE Photonics Technology Letters · 2007 · 23 citations

Micropillar Arrays, Engineering, Textured Micropillar Arrays +16

Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn–3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip

Chih‐Tang Peng, Chia‐Tai Kuo, Kuo‐Ning Chiang et al. · Microelectronics Reliability · 2005 · 20 citations

Materials Science, Materials Engineering, Intermetallic Compounds +8

Characterization study of time- and temperature-dependent mechanical behavior of polyimide materials in electronic packaging applications

Chia‐Tai Kuo, Ming‐Chuen Yip, Kuo‐Ning Chiang et al. · Journal of Electronic Materials · 2005 · 17 citations

Materials Science, Polymer Material, Polyimide Materials +9

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