Ji‐Cheng Lin - Concepedia

Author

Ji‐Cheng Lin

Also Known As

Ji-Cheng Lin, Ji‐Cheng Lin

Publications

129

Citations

H-Index

Concepts

All Affiliations

Ji‐Cheng Lin is an author at National Tsing Hua University specializing in mechanical engineering, engineering, and microfabrication.

#	Concept	H-Index	Publications	Citations
1	Engineering	3	3	100
2	Mechanical Engineering	3	3	100
3	Electrical Engineering	2	2	41
4	Computer Engineering	1	1	27
5	Materials Science	1	1	14

Ji‐Cheng Lin

Publications

100

Citations

H-Index

Page 1

	Year	Citations
Performance and package effect of a novel piezoresistive pressure sensor fabricated by front-side etching technology Chih‐Tang Peng, Ji‐Cheng Lin, Chun‐Te Lin, Sensors and Actuators A Physical EngineeringSensorsMicrofabricationMechanical EngineeringPackage Effect	2004	59
Design and analysis of wafer-level CSP with a double-pad structure Ji‐Cheng Lin, Hsien‐Chie Cheng, Kuo‐Ning Chiang IEEE Transactions on Components and Packaging Technologies EngineeringMechanical EngineeringWlcsp PackagesPhysical Design (Electronics)Wafer Scale Processing	2005	27
A study of factors affecting solder joint fatigue life of thermally enhanced ball grid array assemblies Hsien‐Chie Cheng, Kuo‐Ning Chiang, Chao‐Kuang Chen, Journal of the Chinese Institute of Engineers EngineeringMechanical EngineeringDesign FactorsStructural MaterialsMechanics Modeling	2001	14

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