Concepedia

Ji‐Cheng Lin

JL

3

Publications

100

Citations

3

H-Index

2001

Active since

Affiliations

National Tsing Hua University(Current)

Feng Chia University

Ji‐Cheng Lin is an author at National Tsing Hua University specializing in mechanical engineering, engineering, and microfabrication.

Top concepts

Publications per year

2001–2005

3

Publications

3

Performance and package effect of a novel piezoresistive pressure sensor fabricated by front-side etching technology

Chih‐Tang Peng, Ji‐Cheng Lin, Chun‐Te Lin et al. · Sensors and Actuators A Physical · 2004 · 59 citations

, , +8

Design and analysis of wafer-level CSP with a double-pad structure

Ji‐Cheng Lin, Hsien‐Chie Cheng, Kuo‐Ning Chiang · IEEE Transactions on Components and Packaging Technologies · 2005 · 27 citations

, , +18

A study of factors affecting solder joint fatigue life of thermally enhanced ball grid array assemblies

Hsien‐Chie Cheng, Kuo‐Ning Chiang, Chao‐Kuang Chen et al. · Journal of the Chinese Institute of Engineers · 2001 · 14 citations

, , +16

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