Concepedia

Chip-scale Packaging

Chip-Scale Packaging is a type of integrated circuit packaging technology that encapsulates a semiconductor chip with dimensions no greater than 1.2 times the size of the die itself, enabling minimal footprint integration while maintaining direct interconnection and protection comparable to traditional packaging.

371

Publications

11.7K

Citations

1.4K

Authors

284

Institutions

Publications per year

2017–2026

56

Parents

Publications

371

Recent Advances and Trends in Advanced Packaging

John H. Lau · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 585 citations

, , +15

Solder joint fatigue models: review and applicability to chip scale packages

W.W Lee, Luu Nguyen, Guna S Selvaduray · Microelectronics Reliability · 2000 · 507 citations

, , +11

Design for assembly

G. Boothroyd, W.A. Knight · IEEE Spectrum · 1993 · 258 citations

, , +13

Wafer level chip scale packaging (WL-CSP): an overview

P. Garrou · IEEE Transactions on Advanced Packaging · 2000 · 183 citations

, , +13

Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition

Yi‐Shao Lai, Ping‐Feng Yang, Chang-Lin Yeh · Microelectronics Reliability · 2005 · 180 citations

, , +14

1–5 of 371

Authors

1.4K

  1. KC
    Kuo‐Ning Chiang

    National Tsing Hua University, Taiwan

    17 publications · 479 citations

    13

    h-index

  2. YL
    Yi‐Shao Lai

    Advanced Semiconductor Engineering (Taiwan), Taiwan

    16 publications · 467 citations

    12

    h-index

  3. XF
    Xuejun Fan

    Lamar University, United States

    11 publications · 266 citations

    11

    h-index

  4. JH
    John H. Lau

    Industrial Technology Research Institute, Taiwan

    10 publications · 839 citations

    10

    h-index

  5. LN
    Luu Nguyen

    Texas Instruments (United States), United States

    10 publications · 701 citations

    10

    h-index

1–5 of 1.4K

Institutions

284

  1. Advanced Semiconductor Engineering (Taiwan)

    Kaohsiung, Taiwan

    14 h-index

    74 publications

    1.9K citations

  2. National Tsing Hua University

    Hsinchu, Taiwan

    13 h-index

    50 publications

    1.4K citations

  3. Amkor Technology (United States)

    Tempe, United States

    13 h-index

    63 publications

    2.7K citations

  4. Texas Instruments (United States)

    Dallas, United States

    11 h-index

    33 publications

    827 citations

  5. Georgia Institute of Technology

    Atlanta, United States

    10 h-index

    34 publications

    555 citations

  6. Motorola (United States)

    Schaumburg, United States

    10 h-index

    32 publications

    547 citations

  7. Taiwan Semiconductor Manufacturing Company (Taiwan)

    Hsinchu, Taiwan

    9 h-index

    36 publications

    1.1K citations

  8. Binghamton University

    Binghamton, United States

    9 h-index

    30 publications

    687 citations

1–8 of 284

Venues

  1. Microelectronics Reliability

    20 publications · 1.4K citations

    17

    h-index

  2. IEEE Transactions on Advanced Packaging

    20 publications · 692 citations

    14

    h-index

  3. Journal of Electronic Packaging

    18 publications · 476 citations

    13

    h-index

  4. 11

    h-index

  5. 10

    h-index

1–5