Concepedia

P. Garrou

PG

3

Publications

224

Citations

3

H-Index

2000

Active since

Affiliations

Dow Chemical (United States)(Current)

P. Garrou is an author at Dow Chemical (United States) specializing in engineering, computer engineering, and electronic packaging.

Top concepts

EngineeringApplied PhysicsMaterial ScienceMicroelectronicsMicrofabricationComputer EngineeringElectronic PackagingTechnology3D PrintingSelf-assembly

Publications per year

2000–2008

3

Publications

3

Wafer level chip scale packaging (WL-CSP): an overview

P. Garrou · IEEE Transactions on Advanced Packaging · 2000 · 182 citations

Electrical Engineering, Chip-scale Package, Engineering +11

Transfer printing: An approach for massively parallel assembly of microscale devices

Christopher A. Bower, Etienne Menard, P. Garrou · 2008 · 31 citations

Engineering, Mechanical Engineering, Pattern Transfer +20

Underfill adhesion to BCB (Cyclotene/sup TM/) bumping and redistribution dielectrics

P. Garrou, D. Scheck, Jang‐Hi Im et al. · IEEE Transactions on Advanced Packaging · 2000 · 11 citations

Materials Engineering, Materials Science, Engineering +10

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