Jang‐Hi Im

Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects

Suk-Kyu Ryu, Kuan-Hsun Lu, Xuefeng Zhang et al. · IEEE Transactions on Device and Materials Reliability · 2010 · 257 citations

Engineering, Electrical Engineering, Materials Science +17

Effect of Thermal Stresses on Carrier Mobility and Keep-Out Zone Around Through-Silicon Vias for 3-D Integration

Suk-Kyu Ryu, Kuan-Hsun Lu, Tengfei Jiang et al. · IEEE Transactions on Device and Materials Reliability · 2012 · 119 citations

Engineering, Electrical Engineering, Materials Science +17

Chip–Package Interaction and Reliability Improvement by Structure Optimization for Ultralow-$k$ Interconnects in Flip-Chip Packages

Xuefeng Zhang, Yiwei Wang, Jang‐Hi Im et al. · IEEE Transactions on Device and Materials Reliability · 2012 · 51 citations

Engineering, Electrical Engineering, Materials Engineering +17

On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications

Jang‐Hi Im, Edward O. Shaffer, T. M. Stokich et al. · Journal of Electronic Packaging · 1999 · 37 citations

Natural Sciences, Materials Engineering, Materials Science +17

Divinylsiloxane‐bisbenzocyclobutene‐based polymer modified with polystyrene–polybutadiene–polystyrene triblock copolymers

Ying‐Hung So, Pamela Foster, Jang‐Hi Im et al. · Journal of Polymer Science Part A Polymer Chemistry · 2006 · 20 citations

Natural Sciences, Materials Engineering, Materials Science +17