Biomems Packaging
BioMEMS Packaging is the subfield of microsystem packaging that focuses on the design, materials selection, and fabrication of protective, biocompatible, and functional encapsulation and interconnection structures for biomedical microelectromechanical systems operating in physiological or other biological environments.
52
Publications
1.4K
Citations
246
Authors
104
Institutions
Publications per year
2017–2026
12
52
1–5 of 52
246
2
h-index
2
h-index
2 publications · 67 citations
2
h-index
1
h-index
1
h-index
1–5 of 246
104

Centre National de la Recherche Scientifique
Paris, France
3 h-index
14 publications
256 citations
State Key Laboratory of Transducer Technology
Shanghai, China
2 h-index
8 publications
80 citations
Institute of Electronics
Beijing, China
2 h-index
8 publications
80 citations
University of Colorado Boulder
Boulder, United States
2 h-index
6 publications
132 citations

Chinese Academy of Sciences
Beijing, China
2 h-index
8 publications
80 citations
Fraunhofer Institute for Reliability and Microintegration
Berlin, Germany
2 h-index
6 publications
580 citations

Chinese Culture University
Taipei, Taiwan
1 h-index
1 publications
75 citations
Universiti Malaysia Perlis
Perlis, Malaysia
1 h-index
6 publications
120 citations
1–8 of 104
6 publications · 208 citations
6
h-index
4 publications · 141 citations
4
h-index
3 publications · 157 citations
3
h-index
JMM · 2 publications · 52 citations
2
h-index
2 publications · 159 citations
2
h-index
1–5