Biomems Packaging

BioMEMS Packaging is the subfield of microsystem packaging that focuses on the design, materials selection, and fabrication of protective, biocompatible, and functional encapsulation and interconnection structures for biomedical microelectromechanical systems operating in physiological or other biological environments.

52

Publications

1.4K

Citations

246

Authors

104

Institutions

Publications per year

2017–2026

12

Authors

246

  1. CL
    Changchun Liu

    Chinese Academy of Sciences, China

    2 publications · 20 citations

    2

    h-index

  2. DC
    Dafu Cui

    Chinese Academy of Sciences, China

    2 publications · 20 citations

    2

    h-index

  3. BW
    Bob Willis

    2 publications · 67 citations

    2

    h-index

  4. KH
    Ki-Ho Han

    Inje University, South Korea

    1 publications · 17 citations

    1

    h-index

  5. JR
    Jean‐Michel Redouté

    Monash University, Australia

    1 publications · 26 citations

    1

    h-index

1–5 of 246

Venues

  1. Microsystem Technologies

    6 publications · 208 citations

    6

    h-index

  2. Biosensors and Bioelectronics

    4 publications · 141 citations

    4

    h-index

  3. Sensors and Actuators B Chemical

    3 publications · 157 citations

    3

    h-index

  4. Journal of Micromechanics and Microengineering

    JMM · 2 publications · 52 citations

    2

    h-index

  5. IEEE Transactions on Advanced Packaging

    2 publications · 159 citations

    2

    h-index

1–5