Concepedia

Electrical Interconnect Reliability

Electircular Interconnect Reliability is a performance metric that quantifies the durability and consistency of electrical connections within BioMEMS packages under operational and environmental stresses, distinguishing it from other reliability metrics by its specific focus on signal integrity and conductive pathway stability.

121

Publications

4.3K

Citations

560

Authors

121

Institutions

Publications per year

2017–2026

10

Parents

Publications

121

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Geert Van der Plas, Paresh Limaye, Igor Loi et al. · IEEE Journal of Solid-State Circuits · 2010 · 308 citations

, , +17

Reliability challenges for copper interconnects

Baozhen Li, Timothy D. Sullivan, Tom C. Lee et al. · Microelectronics Reliability · 2003 · 285 citations

, , +14

Copper interconnection integration and reliability

C.‐K. Hu, B. M. Luther, F. B. Kaufman et al. · Thin Solid Films · 1995 · 224 citations

, , +12

Advanced Interconnects: Materials, Processing, and Reliability

Mikhaı̈l R. Baklanov, Christoph Adelmann, Larry Zhao et al. · ECS Journal of Solid State Science and Technology · 2014 · 131 citations · Full text

, , +17

Thermal stress characteristics of Cu/oxide and Cu/low-k submicron interconnect structures

Seung-Hyun Rhee, Yong Du, Paul S. Ho · Journal of Applied Physics · 2003 · 121 citations

, , +17

1–5 of 121

Authors

560

  1. CV
    Carl V. Thompson

    Massachusetts Institute of Technology, United States

    10 publications · 282 citations

    10

    h-index

  2. PS
    Paul S. Ho

    The University of Texas at Austin, United States

    6 publications · 257 citations

    6

    h-index

  3. NC
    N.W. Cheung

    University of California, Berkeley, United States

    4 publications · 56 citations

    4

    h-index

  4. YH
    Y. Hayashi

    NEC (Japan), Japan

    3 publications · 51 citations

    3

    h-index

  5. KL
    K. L. Pey

    Nanyang Technological University, Singapore

    3 publications · 52 citations

    3

    h-index

1–5 of 560

Institutions

121

  1. Massachusetts Institute of Technology

    Cambridge, United States

    10 h-index

    20 publications

    619 citations

  2. IMEC

    Leuven, Belgium

    9 h-index

    104 publications

    13.9K citations

  3. Nanyang Technological University

    Singapore, Singapore

    7 h-index

    14 publications

    373 citations

  4. The University of Texas at Austin

    Austin, United States

    7 h-index

    27 publications

    1.3K citations

  5. Advanced Micro Devices (United States)

    Sunnyvale, United States

    6 h-index

    11 publications

    278 citations

  6. IBM (United States)

    Armonk, United States

    6 h-index

    28 publications

    3.2K citations

  7. Motorola (United States)

    Schaumburg, United States

    6 h-index

    21 publications

    554 citations

  8. Intel (United States)

    Santa Clara, United States

    5 h-index

    16 publications

    465 citations

1–8 of 121

Venues

  1. Journal of Applied Physics

    9 publications · 394 citations

    9

    h-index

  2. Microelectronics Reliability

    7 publications · 418 citations

    7

    h-index

  3. IEEE Transactions on Electron Devices

    5 publications · 81 citations

    5

    h-index

  4. Microelectronic Engineering

    5 publications · 142 citations

    5

    h-index

  5. Applied Physics Letters

    5 publications · 169 citations

    5

    h-index

1–5