Larry Zhao

Advanced Interconnects: Materials, Processing, and Reliability

Mikhaı̈l R. Baklanov, Christoph Adelmann, Larry Zhao et al. · ECS Journal of Solid State Science and Technology · 2014 · 131 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Microstructural characterization of inlaid copper interconnect lines

Paul R. Besser, Ehrenfried Zschech, Werner Blum et al. · Journal of Electronic Materials · 2001 · 70 citations

Engineering, Electrical Engineering, Materials Engineering +14

Nanoscale Noncontact Subsurface Investigations of Mechanical and Optical Properties of Nanoporous Low-<i>k</i> Material Thin Film

Alexey M. Lomonosov, Adil Ayouch, P. Ruello et al. · ACS Nano · 2012 · 69 citations

Natural Sciences, Materials Engineering, Materials Science +17

Direct observation of the 1/E dependence of time dependent dielectric breakdown in the presence of copper

Larry Zhao, Zsolt Tökei, Kristof Croes et al. · Applied Physics Letters · 2011 · 58 citations

Natural Sciences, Materials Science, Physics +15

Effect of porogen residue on electrical characteristics of ultra low-k materials

Mikhaı̈l R. Baklanov, Larry Zhao, Els Van Besien et al. · Microelectronic Engineering · 2010 · 46 citations

Natural Sciences, Materials Engineering, Materials Science +11