Paul R. Besser

Texture analysis of damascene-fabricated Cu lines by x-ray diffraction and electron backscatter diffraction and its impact on electromigration performance

Linda Vanasupa, Young‐Chang Joo, Paul R. Besser et al. · Journal of Applied Physics · 1999 · 107 citations

Engineering, Tin Barrier Layers, Damascene-fabricated Cu Lines +19

<i>In</i> <i>situ</i> scanning electron microscopy observation of the dynamic behavior of electromigration voids in passivated aluminum lines

Paul R. Besser, Michael C. Madden, Paul A. Flinn · Journal of Applied Physics · 1992 · 77 citations

Materials Science, Electrical Engineering, Passivated Aluminum Lines +15

Microstructural characterization of inlaid copper interconnect lines

Paul R. Besser, Ehrenfried Zschech, Werner Blum et al. · Journal of Electronic Materials · 2001 · 70 citations

Materials Science, Electromigration Technique, Engineering +6

An x-ray method for direct determination of the strain state and strain relaxation in micron-scale passivated metallization lines during thermal cycling

Paul R. Besser, S. Brennan, J. C. Bravman · Journal of materials research/Pratt's guide to venture capital sources · 1994 · 62 citations

Materials Science, Materials Engineering, Engineering +11

Scalability of strained-Si nMOSFETs down to 25 nm gate length

Jung-Suk Goo, Qian Xiang, Yuzuru Takamura et al. · IEEE Electron Device Letters · 2003 · 57 citations

Electrical Engineering, Engineering, Strained-si Nmosfets +9