Paul A. Flinn - Concepedia

Author

Paul A. Flinn

Intel (United States)

Also Known As

PAUL A. FLINN, Paul A. Flinn, Paul Flinn

Publications

1.8K

Citations

H-Index

Concepts

All Affiliations

Intel (United States)Stanford University Carnegie Mellon University Mission College Argonne National Laboratory

About

Paul A. Flinn is an author at Intel (United States) specializing in engineering, applied physics, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	20	26	1.6K
2	Applied Physics	18	21	1.1K
3	Natural Sciences	4	4	193
4	Medicine	1	1	23
5	Public Health	1	1	28

Paul A. Flinn

Publications

1.7K

Citations

H-Index

Page 1

	Year	Citations
The Role of Indentation Depth on the Measured Hardness of Materials Melissa Shell De Guzman, G. Neubauer, Paul A. Flinn, MRS Proceedings Materials ScienceEngineeringMechanical BehaviorMeasured HardnessStrength Property	1993	245
X-ray diffraction determination of the effect of various passivations on stress in metal films and patterned lines Paul A. Flinn, Chien Chiang Journal of Applied Physics EngineeringSevere Plastic DeformationVarious PassivationsResidual StressCompressive Silicon Nitride	1990	167
Mössbauer Effect in Tin Compounds: Interpretation of Isomer Shifts and Determination of the Nuclear Radius Change in 119Sn Joseph K. Lees, Paul A. Flinn The Journal of Chemical Physics EngineeringNuclear PhysicsIonic StatesComputational ChemistryChemistry	1968	147
Measurement and interpretation of stress in copper films as a function of thermal history Paul A. Flinn Journal of materials research/Pratt's guide to venture capital sources Materials ScienceMaterials EngineeringEngineeringSevere Plastic DeformationApplied Physics	1991	132
Stress in metal lines under passivation; comparison of experiment with finite element calculations Barbara Greenebaum, Anne I. Sauter, Paul A. Flinn, Applied Physics Letters Aluminium NitrideEngineeringSevere Plastic DeformationMechanical EngineeringMetal Lines	1991	114
Principles and Applications of Wafer Curvature Techniques for Stress Measurements in Thin Films Paul A. Flinn MRS Proceedings Materials ScienceStress MeasurementsWafer Curvature TechniquesEngineeringApplied Physics	1988	112
Mechanical properties and microstructural characterization of Al-0.5%Cu thin films Ramnath Venkatraman, J. C. Bravman, William D. Nix, Journal of Electronic Materials Materials ScienceAluminium NitrideEngineeringMechanical EngineeringThin Films	1990	110
Mechanical stress as a function of temperature for aluminum alloy films Donald S. Gardner, Paul A. Flinn Journal of Applied Physics Aluminium NitrideEngineeringSevere Plastic DeformationMechanical EngineeringCold Working	1990	100
<i>In</i> <i>situ</i> scanning electron microscopy observation of the dynamic behavior of electromigration voids in passivated aluminum lines Paul R. Besser, Michael C. Madden, Paul A. Flinn Journal of Applied Physics Materials ScienceElectrical EngineeringPassivated Aluminum LinesDynamic BehaviorEm Voids	1992	77
Mechanical Stress in VLSI Interconnections: Origins, Effects, Measurement, and Modeling Paul A. Flinn MRS Bulletin Physical Design (Electronics)EngineeringAdvanced Packaging (Semiconductors)MechanicsStress-induced Leakage Current	1995	52

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