Publication | Closed Access
Measurement and interpretation of stress in copper films as a function of thermal history
132
Citations
10
References
1991
Year
Materials ScienceMaterials EngineeringEngineeringSevere Plastic DeformationApplied PhysicsCopper FilmsStressstrain AnalysisMetallurgical InteractionResidual StressHigh Strain RateElectronic PackagingThin FilmsPlasticityMechanics Of MaterialsMicrostructureThermal History
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