Werner Blum

Microstructural characterization of inlaid copper interconnect lines

Paul R. Besser, Ehrenfried Zschech, Werner Blum et al. · Journal of Electronic Materials · 2001 · 70 citations

Engineering, Electrical Engineering, Materials Engineering +14

Applied mathematical problem solving, modelling, applications, and links to other subjects

Werner Blum, Mogens Niss · Kobra (Universitätsbibliothek Kassel) · 1991 · 46 citations · Full text

Education, Mathematics, Mathematics Education +14

Orientation Relationships of Reactively Grown Ba ₆ Ti ₁₇ O ₄₀ and Ba ₂ TiSi ₂ O ₈ on BaTiO ₃ (001) Determined by X‐ray Diffractometry

Stephan Senz, Andreas Graff, Werner Blum et al. · Journal of the American Ceramic Society · 1998 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +17

Effect of Copper Line Geometry and Process Parameters on Interconnect Microstructure and Degradation Processes

Ehrenfried Zschech, Werner Blum, I. Zienert et al. · International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde) · 2001 · 19 citations

Natural Sciences, Materials Engineering, Materials Science +17

The Influence of Capping Layer Type on Cobalt Salicide Formation in Films and Narrow Lines

Paul R. Besser, A. Lauwers, N. Roelandts et al. · MRS Proceedings · 1998 · 18 citations

Natural Sciences, Materials Engineering, Materials Science +11