Zsolt Tökei - Concepedia

Author

Zsolt Tökei

Also Known As

Christopher Wilson, D. Trivkovic, T. Zsolt, Tokei Zsolt, Tokei, Z, Tokei, Zsolt, Tökei, Zsolt, Tőkei, Zsolt, Wilson, Christopher J., Z. S. Tokei

366

Publications

3.9K

Citations

H-Index

123

Concepts

All Affiliations

IMEC KU Leuven

About

Zsolt Tökei is an author at IMEC specializing in engineering, applied physics, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	30	84	2.8K
2	Applied Physics	29	69	2.4K
3	Natural Sciences	1	1	57
4	Social Sciences	1	1	23
5	Biostatistics	1	1	24

Zsolt Tökei

102

Publications

3.1K

Citations

H-Index

Page 1

	Year	Citations
Size-Dependent Resistivity in Nanoscale Interconnects D. Josell, Sywert Brongersma, Zsolt Tökei Annual Review of Materials Research EngineeringCopper ConductorsInterconnect (Integrated Circuits)NanoelectronicsNanoscale Modeling	2009	275
Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper Liang Wen, Philippe Roussel, Olalla Varela Pedreira, ACS Applied Materials & Interfaces	2016	138
Future Logic Scaling: Towards Atomic Channels and Deconstructed Chips Srikanth Samavedam, Julien Ryckaert, Eric Beyne, EngineeringVlsi DesignLogic ScalingComputer ArchitectureMemory Access	2020	109
Highly Scaled Ruthenium Interconnects Shibesh Dutta, Shreya Kundu, Anshul Gupta, IEEE Electron Device Letters Materials ScienceStaneneElectrical EngineeringMetal-spacer Patterning TechniqueEngineering	2017	90
Alternative metals for advanced interconnects Christoph Adelmann, Liang Wen, Antony Premkumar Peter, Materials ScienceMaterials EngineeringElectrical EngineeringAlternative MetalsTransition Metal Germanides	2014	87
Influence of absorbed water components on SiOCH low-k reliability Yunlong Li, Ivan Ciofi, L. Carbonell, Journal of Applied Physics Absorbed Water ComponentsReliability EngineeringChemisorbed Water ComponentEngineeringEnvironmental Engineering	2008	86
Sub-100 nm<sup>2</sup> Cobalt Interconnects Shibesh Dutta, Sofie Beyne, Anshul Gupta, IEEE Electron Device Letters Electrical EngineeringHigh-tc SuperconductivityEngineeringSpecific ResistanceElectromigration Technique	2018	82
Ruthenium metallization for advanced interconnects Liang Wen, Christoph Adelmann, Olalla Varela Pedreira, Materials EngineeringMaterials ScienceElectrical EngineeringElectromigration TechniqueEngineering	2016	63
Modeling of Via Resistance for Advanced Technology Nodes Ivan Ciofi, Philippe Roussel, Yves Saad, IEEE Transactions on Electron Devices EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Electromagnetic CompatibilityPrefill Level	2017	61
Reliability of copper low-k interconnects Zsolt Tökei, Kristof Croes, Gerald Beyer Microelectronic Engineering ReliabilityElectrical EngineeringReliability EngineeringEngineeringHardware Reliability	2009	58

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