Shibesh Dutta

Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper

Liang Wen, Philippe Roussel, Olalla Varela Pedreira et al. · ACS Applied Materials & Interfaces · 2016 · 138 citations

Highly Scaled Ruthenium Interconnects

Shibesh Dutta, Shreya Kundu, Anshul Gupta et al. · IEEE Electron Device Letters · 2017 · 90 citations

Materials Science, Stanene, Electrical Engineering +10

Sub-100 nm² Cobalt Interconnects

Shibesh Dutta, Sofie Beyne, Anshul Gupta et al. · IEEE Electron Device Letters · 2018 · 82 citations

Electrical Engineering, High-tc Superconductivity, Engineering +14

Ruthenium metallization for advanced interconnects

Liang Wen, Christoph Adelmann, Olalla Varela Pedreira et al. · 2016 · 63 citations

Materials Engineering, Materials Science, Electrical Engineering +14

Atomic Layer Deposition of Ruthenium Thin Films from (Ethylbenzyl) (1-Ethyl-1,4-cyclohexadienyl) Ru: Process Characteristics, Surface Chemistry, and Film Properties

M. Popovici, Benjamin Groven, Kristof Marcoen et al. · Chemistry of Materials · 2017 · 54 citations

Engineering, Chemistry, Chemical Deposition +18