Concepedia

Ceramic Packaging

Ceramic Packaging is a type of MEMS packaging that uses ceramic materials as the primary structural and protective enclosure for microelectromechanical systems, distinguished by its hermeticity, thermal stability, and electrical insulation properties.

80

Publications

3K

Citations

338

Authors

107

Institutions

Publications per year

2017–2026

6

Parents

Publications

80

Ceramic and Glass‐Ceramic Packaging in the 1990s

Rao Tummala · Journal of the American Ceramic Society · 1991 · 740 citations

, , +17

Cold sintering process: A new era for ceramic packaging and microwave device development

Jing Guo, Amanda Baker, Hanzheng Guo et al. · Journal of the American Ceramic Society · 2016 · 197 citations

, , +17

Cordierite glass-ceramics for multilayer ceramic packaging

Sarah H. Knickerbocker, Alip Kumar, L. W. Herron · American Ceramic Society bulletin · 1993 · 192 citations

, , +15

Stable Electrical Operation of 6H–SiC JFETs and ICs for Thousands of Hours at 500 $^{\circ}\hbox{C}$

Philip G. Neudeck, David J. Spry, Liang-Yü Chen et al. · IEEE Electron Device Letters · 2008 · 128 citations

, , +17

LTCC technology: where we are and where we're going. II

Charles Q. Scrantom, J.C. Lawson · 1999 · 89 citations

, , +15

1–5 of 80

Authors

338

  1. UC
    U. Chowdhry

    DuPont (United States), United States

    3 publications · 58 citations

    3

    h-index

  2. RE
    Robert E. Newnham

    Pennsylvania State University, United States

    2 publications · 135 citations

    2

    h-index

  3. PG
    Philip G. Neudeck

    Glenn Research Center, United States

    2 publications · 140 citations

    2

    h-index

  4. CG
    Chantal Gensse

    DuPont (United States), United States

    2 publications · 21 citations

    2

    h-index

  5. MS
    Maciej Sobociński

    University of Oulu, Finland

    2 publications · 26 citations

    2

    h-index

1–5 of 338

Institutions

107

  1. IBM (United States)

    Armonk, United States

    6 h-index

    21 publications

    1.2K citations

  2. Pennsylvania State University

    State College, United States

    4 h-index

    12 publications

    1.3K citations

  3. Motorola (United States)

    Schaumburg, United States

    3 h-index

    21 publications

    226 citations

  4. AT&T (United States)

    Bedminster, United States

    2 h-index

    3 publications

    55 citations

  5. IBM Research - Thomas J. Watson Research Center

    Yorktown Heights, United States

    2 h-index

    17 publications

    404 citations

  6. Linköping University

    Linköping, Sweden

    2 h-index

    4 publications

    52 citations

  7. Glenn Research Center

    Cleveland, United States

    2 h-index

    13 publications

    1.3K citations

  8. University of Oulu

    Oulu, Finland

    2 h-index

    12 publications

    156 citations

1–8 of 107

Venues

  1. MRS Proceedings

    5 publications · 59 citations

    5

    h-index

  2. Journal of the American Ceramic Society

    3 publications · 952 citations

    3

    h-index

  3. Microelectronics Reliability

    3 publications · 61 citations

    3

    h-index

  4. Journal of Electronic Packaging

    3 publications · 48 citations

    3

    h-index

  5. Journal of Electronic Materials

    JEM · 2 publications · 33 citations

    2

    h-index

1–5