Ceramic and Glass‐Ceramic Packaging in the 1990s

TLDR

Packaging of semiconductor chips requires interconnecting, powering, protecting, and cooling, with ceramics meeting thermal, mechanical, electrical, and dimensional control needs for both high‑ and low‑performance systems. Glass‑ceramic/copper substrate technology exemplifies high‑performance ceramic packaging used in the 1990s. Glass‑ceramics are best for high‑performance systems, while aluminum nitride, alumina, or mullite suit low‑performance systems, and lower‑dielectric‑constant composites of silica, borosilicate, and cordierite (with or without polymers and porosity) are projected as future substrate materials by 2000.

Abstract

A broad overview of packaging involving interconnecting, powering, protecting, and cooling semiconductor chips to meet a variety of computer system needs is presented. The general requirements for ceramics in terms of their thermal, mechanical, electrical, and dimensional control requirements are presented, both for high‐performance and low‐performance applications. Glass‐ceramics are identified as the best candidates for high‐performance systems, and aluminum nitride, alumina, or mullite are identified for low‐performance systems. Glass‐ceramic/copper substrate technology is discussed as an example of high‐performance ceramic packaging for use in 1990s. Lower‐dielectric‐constant ceramics such as composites of silica, borosilicate, and cordierite, with or without polymers and porosity, are projected as potential ceramic substrate materials by the year 2000.