Concepedia

Marie Cole

MC

4

Publications

106

Citations

4

H-Index

1992

Active since

Affiliations

IBM (United States)(Current)

Marie Cole is an author at IBM (United States) specializing in mechanical engineering, engineering, and microelectronics.

Top concepts

EngineeringMechanical EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringMaterial ScienceMicrofabricationComputer EngineeringMechanics Of MaterialsReliability

Publications per year

1992–2004

4

Publications

4

Constant strain rate tensile properties of various lead based solder alloys at 0, 50, and 100°C

Marie Cole, Thomas R. Caulfield · Scripta Metallurgica et Materialia · 1992 · 35 citations

Materials Science, Engineering, Mechanical Properties +6

Ceramic column grid array for flip chip applications

R.N. Master, Marie Cole, Gregory Martin et al. · 2002 · 34 citations

Electrical Engineering, Engineering, Durability Performance +15

Ceramic ball grid array for AMD K6 microprocessor application

R.N. Master, Thomas Dolbear, Marie Cole et al. · 2002 · 20 citations

Reliability, Thin Package, Electrical Engineering +14

Lead-free package interconnections for ceramic grid arrays

M. J. Interrante, J. Coffin, Marie Cole et al. · 2004 · 17 citations

Materials Science, Materials Engineering, Electrical Engineering +14

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