J. Coffin is an author at IBM (United States) specializing in electronic packaging, mechanical engineering, and materials engineering.
Top concepts
EngineeringMicrostructureMaterial ScienceMicroelectronicsThermal EngineeringElectronic PackagingMaterials EngineeringElectrical EngineeringMechanical Engineering
Publications per year
2004–2004
1
1
Lead-free package interconnections for ceramic grid arrays
M. J. Interrante, J. Coffin, Marie Cole et al. · 2004 · 17 citations
Materials Science, Materials Engineering, Electrical Engineering +14
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