M. J. Interrante

Three-dimensional silicon integration

John Knickerbocker, Paul Andry, B. Dang et al. · IBM Journal of Research and Development · 2008 · 493 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

3D chip stacking with C4 technology

B. Dang, S. L. Wright, Paul Andry et al. · IBM Journal of Research and Development · 2008 · 47 citations

Engineering, Computer Engineering, Low-power Design +16

An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates

Katsuyuki Sakuma, Krishna Tunga, Buck Webb et al. · 2015 · 37 citations

Engineering, Materials Engineering, Materials Science +15

Lead-free package interconnections for ceramic grid arrays

M. J. Interrante, J. Coffin, Marie Cole et al. · 2004 · 17 citations

Engineering, Electrical Engineering, Materials Engineering +13

Flip chip assembly method employing differential heating/cooling for large dies with coreless substrates

Katsuyuki Sakuma, Edmund Blackshear, Krishna Tunga et al. · 2013 · 11 citations

Engineering, Materials Engineering, Materials Science +17