Concepedia

R.N. Master

RM

19

Publications

476

Citations

15

H-Index

1991

Active since

Affiliations

Advanced Micro Devices (United States)(Current)

IBM (United States)

Advanced Micro Devices (Canada)

Georgia Institute of Technology

Microsoft (United States)

R.N. Master is an author at Advanced Micro Devices (United States) specializing in engineering, electronic packaging, and microelectronics.

Top concepts

EngineeringElectronic PackagingMicroelectronicsMaterial ScienceElectrical EngineeringMechanical EngineeringMicrofabricationComputer EngineeringMechanics Of MaterialsHeat Transfer

Publications per year

1991–2025

19

Publications

19

Investigation of Cu/Low-K Film Delamination in Flip-Chip Packages

Charlie Jun Zhai, U. Ozkan, A. DubeySidharth et al. · 2006 · 45 citations

Energy Release Rate, Engineering, Mechanical Engineering +18

High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution

Rao Tummala, John Knickerbocker, Sarah H. Knickerbocker et al. · IBM Journal of Research and Development · 1992 · 41 citations

Materials Science, Glass-ceramic, Molybdenum Paste +15

Modeling of Power Supply Noise in Large Chips Using the Circuit-Based Finite-Difference Time-Domain Method

Jung-Hwan Choi, Madhavan Swaminathan, N. Do et al. · IEEE Transactions on Electromagnetic Compatibility · 2005 · 40 citations

Electrical Engineering, Physical Design (Electronics), Engineering +15

Indium thermal interface material development for microprocessors

Sean S. Too, Maxat Touzelbaev, Mohammad Khan et al. · 2009 · 40 citations

Engineering, Mechanical Engineering, Thermal Conductivity +18

Soft, stretchable conductive hydrogels for high-performance electronic implants

Md. Saifur Rahman, Ahnsei Shon, Rose Joseph et al. · Science Advances · 2025 · 37 citations · Full text

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