R.N. Master - Concepedia

Author

R.N. Master

Advanced Micro Devices (United States)

Also Known As

R. Master, R. N. Master, R.N. Master, Raj Master, Raj N Master, Raj N. Master, Raj. N. Master, Reid Master

Publications

560

Citations

H-Index

Concepts

All Affiliations

Advanced Micro Devices (United States)IBM (United States)Advanced Micro Devices (Canada)Georgia Institute of Technology Microsoft (United States)

About

R.N. Master is an author at Advanced Micro Devices (United States) specializing in engineering, electronic packaging, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	14	17	428
2	Electrical Engineering	11	11	293
3	Computer Engineering	6	6	148
4	Applied Physics	4	4	117
5	Materials Engineering	4	4	129

R.N. Master

Publications

476

Citations

H-Index

Page 1

	Year	Citations
Investigation of Cu/Low-K Film Delamination in Flip-Chip Packages Charlie Jun Zhai, U. Ozkan, A. DubeySidharth, Energy Release RateEngineeringMechanical EngineeringCpi ReliabilityFlip-chip Packages	2006	45
High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution Rao Tummala, John Knickerbocker, Sarah H. Knickerbocker, IBM Journal of Research and Development Materials ScienceGlass-ceramicMolybdenum PasteEngineeringMaterials Fabrication	1992	41
Modeling of Power Supply Noise in Large Chips Using the Circuit-Based Finite-Difference Time-Domain Method Jung-Hwan Choi, Madhavan Swaminathan, N. Do, IEEE Transactions on Electromagnetic Compatibility Electrical EngineeringPhysical Design (Electronics)EngineeringVlsi DesignCircuit Design	2005	40
Indium thermal interface material development for microprocessors Sean S. Too, Maxat Touzelbaev, Mohammad Khan, EngineeringMechanical EngineeringThermal ConductivityAdvanced Packaging (Semiconductors)Thermal Analysis	2009	40
Soft, stretchable conductive hydrogels for high-performance electronic implants Md. Saifur Rahman, Ahnsei Shon, Rose Joseph, Science Advances	2025	37
Ceramic column grid array for flip chip applications R.N. Master, Marie Cole, Gregory Martin, Electrical EngineeringEngineeringDurability PerformanceColumn Grid ArrayMicrofabrication	2002	34
Void Formation Study of Flip Chip in Package Using No-Flow Underfill Sang-Il Lee, Myung Jin Yim, R.N. Master, IEEE Transactions on Electronics Packaging Manufacturing EngineeringMechanical EngineeringInterconnect (Integrated Circuits)Flip ChipAdvanced Packaging (Semiconductors)	2008	29
Investigation and Minimization of Underfill Delamination in Flip Chip Packages C.J. Zhai, Sidharth, R.C. BlishII, IEEE Transactions on Device and Materials Reliability Materials ScienceFlip Chip3D Ic ArchitectureChip-scale PackageEngineering	2004	28
Modeling of realistic on-chip power grid using the FDTD method Jinseong Choi, Lixi Wan, Madhavan Swaminathan, IEEE International Symposium on Electromagnetic Compatibility Power EngineeringEngineeringPower Grid OperationNoise PropagationPower Electronics	2003	23
Reliability Study on Copper Pillar Bumping with Lead Free Solder YU Jin-hua, Ashok Anand, Y.C. Mui, EngineeringMechanical EngineeringLead Free SolderInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2007	22

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